CVE

CVE-2023-33063

Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Qualcomm · Multiple Chipsets

Date added (CISA)

2023-12-05

Remediation due

2023-12-26

Known ransomware use

Not indicated

Remediation priority

P2 — past CISA due date

Description

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.